CEVA Collaborates with VisiSonics To Develop A Comprehensive 3D Spatial Audio Solution for Embedded Devices

CEVA VisiSonics 3D Spatial Audio
Image: Screen Post, Unsplash

CEVA, the leading licensor of wireless connectivity and smart sensing technologies, and VisiSonics, a developer of best-in-class, patented 3D spatial audio technologies, have partnered to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones, and other hearables.

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The partnership combines VisiSonics’ RealSpace 3D audio software optimized for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP). The result is a high precision real-time 3D audio solution for System-on-Chip (SoC) vendors, OEMs and ODMs looking to provide the ultimate hearing experience for VR, AR, and the new generation of motion-aware earbuds where 3D audio enhances the overall user experience, says a press release.

VisiSonics RealSpace 3D Embedded for Headphones solution incorporates a suite of algorithms that give the listener a feeling of being present in an actual three-dimensional acoustic scene. CEVA’s powerful audio and sensor hub DSPs, including the CEVA-X2, CEVA-BX1, CEVA-BX2 and SensPro™ family, enable this full suite of algorithms to run seamlessly in an extremely low power footprint.

A woman wearing VR headsets and headphones
With RS3D, VisiSonics leverages world-class scientific discovery to add a third dimension to the sound you hear electronically. (Image: VisiSonics)

“VisiSonics’ RealSpace 3D audio technology provides an incredible listening experience and we’re pleased to collaborate with them to further enhance the performance with our audio/sensor hub DSPs and 3D head tracking software,” said Moshe Sheier, Vice President of Marketing at CEVA. “The use of contextually-aware audio for mobile and wearables is set to grow exponentially in the coming years on the back of 5G, and together with VisiSonics, we can help OEMs and ODMs leverage high precision 3D audio in their hearables to ride this wave.”

CEVA’s scalable audio and sensor hub DSPs are optimized for sound processing applications ranging from always-on voice control up to multiple sensors fusion. They have been specifically designed to tackle multi-microphone speech processing use-cases, high-quality audio playback and post-processing, and on-device sound neural network implementations.

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“By partnering with them to bring our RealSpace 3D Audio technology to headsets and hearables powered by their DSPs, with the ability to offer our state-of-the-art spatial audio personalization to the end-user, we can accelerate the adoption of this technology in mobile applications, and bring the power of immersive 3D audio to everyone,” said Dr. Ramani Duraiswami, CEO, VisiSonics.

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Cathy Russey () is Online Editor at WT | Wearable Technologies and specialized in writing about the latest medical wearables and enabling technologies on the market. Cathy can be contacted at info(at)wearable-technologies.com.